Wafer-Level Parylene Packaging With Integrated RF Electronics for Wireless Retinal Prostheses

Wafer-Level Packaging For RF Passive Integration

Wafer-level packaging (WLP) technology offers novel opportunities for the realisation of highquality on-chip passives needed in RF front-ends. IMEC proposes thin-film WLP technology in combination with 90nm CMOS as a cost-effective approach to integrate RF and microwave systems. The potential of this technology is assessed by means of two demonstrator sub-circuits: a low-power voltage-controlle...

Parasitic Effects Reduction for Wafer-Level Packaging of RF-Mems

In RF-MEMS packaging, next to the protection of movable structures, optimization of package electrical performance plays a very important role. In this work, a wafer-level packaging process has been investigated and optimized in order to minimize electrical parasitic effects. The package concept used is based on a wafer-level bonding of a capping silicon substrate with throughsubstrate intercon...

Implantable Parylene MEMS RF Coil for Epiretinal Prostheses

Wafer Level Packaging with Wedge Seal Method

Wafer level packaging could reduce the cost of MEMS based sensors through simplified processing and inexpensive components. A novel vacuum tight seal referred to as the wedge seal method is proposed in this paper. The seal consists of a silicon wedge forced into a pliable material (typically a metal) that is attached to the component wafer. The wedge-seal addresses some of the requirements of m...

Micromachined Flexible Interconnect for Wafer Level Packaging

Wafer Level Packaging (WLP) of microelectronic circuitry, in which critical package elements are formed on the silicon wafer prior to dicing, has several advantages over conventional packaging techniques, such as one-step testability of multiple chips on a silicon wafer prior to dicing, and the possibility of high input-output (I/O) density. One of the critical elements of WLP is the interconne...